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TSL3301CL
102 ?1 LINEAR OPTICAL SENSOR ARRAY
WITH ANALOG-TO-DIGITAL CONVERTER
TAOS141  JULY 2011
17
The LUMENOLOGY r Company
r
r
Copyright E 2011, TAOS Inc.
www.taosinc.com
SOLDERING INFORMATION
The CL package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
Table 5. Solder Reflow Profile
PARAMETER
REFERENCE
DEVICE
Average temperature gradient in preheating
2.5癈/sec
Soak time
t
soak
2 to 3 minutes
Time above 217癈 (T1)
t
1
Max 60 sec
Time above 230癈 (T2)
t
2
Max 50 sec
Time above T
peak
 10?/SPAN>C  (T3)
t
3
Max 10 sec
Peak temperature in reflow
T
peak
260癈
Temperature gradient in cooling
Max 5癈/sec
t
3
t
2
t
1
t
soak
T
3
T
2
T
1
T
peak
Not to scale  for reference only
Time (sec)
Figure 10. Solder Reflow Profile Graph
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